******************************************************* * Taiwan Semiconductor_ * TSCDH40065G1 * 40A, 650V SiC Merged PIN Schottky Diode * Date: 2024-04-06 ******************************************************* *The model describes the characteristics of typical devices and is subject to change without notice. * *SPICE model can be used for evaluating device performance, but it cannot reflect the real device * *performance under any kind of conditions, nor to replace bread boarding for final verification. * *TSC does not assume any warranty or liability whatever arising from their use. TSC does not assume * *any warranty or liability for the values and functions of the SPICE model. The simulation results of * *the SPICE model are to the best of our knowledge correct. However, users are fully responsible to verify * * and validate these results under the operating conditions and its application. TSC will not bear the * *responsibility arising out of or in connection with any malfunction of the simulation model. In any kind * *of cases, the current datasheet information is the design guideline and the only actual performance * *specification. SPICE model provided by TSC is not warranted by TSC as completely and comprehensively * *representing all the specifications and operating characteristics of the semiconductor product. * * **************************************************************************************************************** .MODEL TSCDH40065G1 D + IS=232.81E-15 + N=1.1645 + RS=23.771E-3 + IKF=609.76 + CJO=1.1574E-9 + M=.40129 + VJ=.94343 + ISR=25.041E-9 + NR=4.9950 + BV=650 + IBV=2E-5 + TT=73.989E-9 *******************************************************